In this research, a series of wood-based panels were produced by using wood chips [beech (Fagus Sylvatica L.) and Scotch pine (Pinus sylvestris L.)] as wastes of wood-working workshops and acrylic fibers as wastes of textiles factory. Four kinds of different panels (Eltapan I, II, III and IV) were obtained by mixing these components in different composition (0%, 25% and 50%). Some physical and mechanical properties of the samples taken from these panels were determined in accordance with ASTM D1037-12 and ASTM-C 1113. The values were compared to properties of industrially produced chipboard. As a result, the textile fibers used as additive material reduced density, thermal conductivity and bending resistance of wood panel and increased dimensional stability of wood panel.
Forest and other natural assets have been used in producing the items that are needed from time immemorial. While use of natural wood material decreased gradually, the use and production of wood-based panels increased by expanding. Wood-based panels developed in order to provide dimensional stability and to obtain large-size sheet [
Animal wool, cotton and synthetic fibers are the basic material of textile production. The main features of these items include durability, length, flexibility, moisture absorption, resistance to heat and light, and being easily washable [
Acrylic fiber is a synthetic fiber that closely resembles wool in its character [
Acrylic fibers are soft and light fibers having light and warm tactile feeling to the human skin [
Some important properties of acrylic fibers are: 1―Lighter than wool fibers, and fabric hand with bulkiness; 2―Superior in warm retention, light and warm; 3―Superior in elastic recovery, and resistant to crease; 4― Excellent in color development and can be dyed in desired color; 5―Little affected by sunlight; 6―Resistant to chemicals and cannot be attacked by molds and insects; 7―Thermoplastic [
Acrylic fiber is composed of acrylonitrile and a co monomer. The co monomer is added to improve dyeability and the textile processability of the acrylic fiber. It can be used 100% alone, or in blends with other natural and synthetic fibers [
Today, the cost, excellence and availability of raw materials are of principal importance. Due to environmental concerns, a very large number of companies are currently developing manufacturing processes using alternative materials for their crop and in search of new markets for the sub-products of their first-line production. Textile industry is an example of the reality that the industry is living these days. The textile industry has taken an increasing interest in developing a system for recycling waste fiber which results from the process of manufacturing product such as textile fabrics and fibers, non-woven fabrics etc. However, because of the lack of effective recycling technique, most of these wastes are currently destroyed by fire or buried underground [
The results showed that laminate produced using epoxy and reinforced with carbon fiber had the highest technological properties [
Bending strength and flexibility were increased on the composite material (gluelam) with glass fiber reinforced [
In the experiments, heat conductivity constant was determined according to ASTM C 1113-90 Hot Wire Method standards [
At the University of Minnesota and some Institutions in a Corporation “Mineral Bonded Composite Panel Research Initiatives and Projects” at the name of research done in the similar timber modification is known that [
The main purpose of this study is to prepare a series of modified panels by mixing the wood chips (beech (Fagus sylvatica L.) and Scotch pine (Pinus sylvestris L.)) and acrylic fibers. These components are collected from the wood-working workshop and textile manufactories as industrial waste materials. It is planned to obtain four types of modified panel by changing the ratio of wood chips and acrylic fibers. Another aim of this study is to investigate some physical and mechanical properties of the modified panels and to compare the values with the industrially produced panels.
In this research wood based panels were produced from a mixture of wood chips and textile waste of acrylic fibers. Urea formaldehyde glue was used to hold the components together. Certain physical and mechanical properties of the panels were determined and the features were compared to the industrially produced particleboard.
Characteristics of acrylic have many appealing properties. Acrylic’s high performance makes it one of the fastest growing fibers in the outdoor, performance apparel categories. This fiber draws moisture away from the skin and quickly transports it to the surface making the wearer more comfortable. Other characteristics of acrylic include: quick drying time, excellent color fastness, UV resistance, soft hand luxurious touch & drape warmth in thermal constructions easy care bulk without extra weight resistance to weathering durability resilience shape retention stain resistance wrinkle resistance and resistance to shrinking, fading, aging, chemicals, oils, moths, mildew, and fungus. Uses of Acrylic not only have many appealing characteristics and advantages, but many apparel, home furnishings, and industrial end uses as well. This fiber accounted for 5 percent of the fiber produced in the United States in 1990 with only three companies producing it at the time [
Some basic properties of acrylic fibers were presented in
Coarse wood chips in roughing planning machines (Moulder) and the fine wood chips in band saw machines on a separate collection system have been booked during processing application workshops beech wood and pine wood at the Gazi University Faculty of Technology Wood Products Industrial Division. Coarse and fine wood chips collected and purified from impurities in amounts necessary for each panel in
Four types of modified panels (Eltapan-I, Eltapan-II, Eltapan-III, Eltapan-IV) were produced by mixing acrylic waste materials and fine-coarse wood chips fiber in different proportions (
In preparing textile fiber panels (fiber + wood panel representing the “Eltapan” has been called) joined textile fiber and wood chips mixture of 25% urea formaldehyde glue and hardener (glue resin: Kaurit and hardener: Ammonium sulphate, Germany).
Textile fibers which can be distributed homogeneously were cut in 10 mm long. Draft panels have produced from basic materials of a homogeneous mixture of obtained wood chips-glue-textile fiber. The mixture pressed 2.5 N/mm2 pressure and temperature conditions of 90˚C for 45 min (OTT brands, hot press, Germany). Basic materials content and ratios of panels in
The glass transition point | 30˚C to 75˚C (water) from 50˚C to 100˚C (dry) |
---|---|
Melting point | 250˚C |
Density | 1.14 to 1.19 g/cm3 |
Copy strength | 2.3 to 3.1 kN/dtex (copolymer), 3.4 to 3.6 kN/dtex (homopolimer) |
Copy percent elongation at | 20% - 48% (copolymer), 30% - 34% (homopolimer) |
Under normal conditions, Humidity | 0.5% |
Less resistance against acids. | |
Hot bases are yellowing. | |
DMF, DMA, are soluble in solvents such as alcohol type is affected by the solvents. | |
Resistant to Light and outdoor weather conditions. |
Panel | Textile fiber | Coarse wood chips (beech) | Coarse wood chips (pine) | Fine wood chips (beech + pine) | Glue |
---|---|---|---|---|---|
Eltapan-I | 25 | 25 | 25 | … | 25 |
Eltapan-II | 25 | ... | … | 50 | 25 |
Eltapan-III | 25 | … | 50 | … | 25 |
Eltapan-IV | 25 | 50 | … | … | 25 |
Ind. Chipboard | Industrially produced and compared with the Eltapan panel board. |
The Extruded panels were conditioned at temperature of 20˚C ± 2˚C and relative humidity of 65% ± 5% for providing equilibrium moisture content of 12%.
The standard sizes for the test to be applied in pre-cut test samples in airtight plastic containers were stored until testing phase.
Tests were applied by 4 tons capacity of Universal Testing Device at 800 kp stage according to ASTM-D143-83 [
In order to determine the effects, contents of textile fiber and wood chips mixture amounts % were performed.
The average density values of modified panels and industrial chipboard which were determined according to ASTM D1037-12 [
According to
Average values of water absorption and thickness swelling of the samples were determined according to ASTM D1037-12 [
As seen in
The coefficient of thermal conductivity is expressed as the quantity of heat that passes through a unit cube of the substance in a given unit of time when the difference in temperature of the two faces is 1˚. Here, the heat conductivity coefficient (l) is expressed as kcal/hr·m·˚C [
The average value of thermal conductivity coefficient of modified panels and industrial chipboard which were
Specifications | Sample Number | Standards |
---|---|---|
Specific gravity | 15 × 5 = 75 | ASTM D1037-12 |
Water absorption and thickness swelling | 15 × 5 = 75 | ASTM D1037-12 |
Thermal conductivity | 15 × 5 = 75 | ASTM-C 1113 |
Bending strength | 15 × 5 = 75 | ASTM D1037-12 |
Samples | Modified Panel | Industrial chipboard | |||
---|---|---|---|---|---|
Eltapan-I | Eltapan-II | Eltapan-III | Eltapan-IV | ||
Density (g/cm3) | 0.60 | 0.56 | 0.61 | 0.68 | 0.65 |
Samples (X) | t (˚C) | l (kcal/mh·˚C) |
---|---|---|
Eltapan-I | 29.6 | 0.1415 |
Eltapan-II | 30.8 | 0.1233 |
Eltapan-III | 30.0 | 0.1418 |
Eltapan-IV | 30.0 | 0.1451 |
Industrial Chipboard | 0.1874 |
determined according to the ASTM-C 1113 [
As seen in
The average of bending strength of modified panels and industrial chipboard which were determined according to the ASTM D1037-12 in
As seen in
All of the average values of swelling, density, thermal conductivity coefficient and bending strength of modified panels and industrial chipboard which were determined according to the ASTM D1037-12 [
The density values of modified panels and industrial chipboard were measured, the highest value (0.68 g/cm3) in industrial chipboard and (0.65 g/cm3) in ELTAP IV, and the lowest value (0.56 g/cm3) in ELTAP II was determined. Overall ranking from low to high:
Eltapan II > Eltapan I > ELTAPAN III > INDUSTRIAL PARTICLEBOARD > Eltapan IV
Eltapan-IV, the cause of the density being high in content of 50% coarse beech wood chips is taking place. Eltapan-II, the cause of the density being low in content of 50% fine wood chips (beech and pine) is taking place.
The thickness swell of the modified panels % ratios as measured. 100% of the maximum swollen thickness as well ELTAP II, 35.5% for the lowest thickness as swelling ratio was also determined ELTAP III. Overall ranking from low to high:
Eltapan III > Eltapan IV > ELTAPAN I > INDUSTRIAL PARTICLEBOARD > Eltapan II
ELTAPAN II contained in the swelling ratio of the thickness of thin beech wood chips panel said that upgrade. Micro fibrils of fine beech wood chips, the inner of the panel and therefore the water absorption of ELTAP II increase [
Swelling ratios of the thickness and density in the modified panels and industrial chipboard panels are shown in the graph of
Thermal conductivity coefficients of the modified panels and industrial chipboard were measured. The highest thermal conductivity coefficient 0.1451 kcal/hr∙m∙˚C as well as ELTAP IV, the lowest thermal conductivity coefficient 0.1233 kcal/hr∙m∙˚C was also determined as an ELTAP II. Overall ranking from low to high:
Samples (X) | Bending Strength (N/mm2) |
---|---|
Eltapan-I | 7.359 |
Eltapan -II | 5.861 |
Eltapan -III | 5.160 |
Eltapan -IV | 14.910 |
Industrial Chipboard | 27.7 |
Panels (X) | Density (g/cm3) | Swelling (%) | Thermal Conductivity Coefficient (kcal/hrm ˚C) | Bending Strength (N/mm2) |
---|---|---|---|---|
Eltapan-I | 0.60 | 57.4 | 0.1415 | 7.36 |
Eltapan-II | 0.56 | 100.0 | 0.1233 | 5.86 |
Eltapan-III | 0.61 | 35.5 | 0.1418 | 5.16 |
Eltapan-IV | 0.65 | 45.4 | 0.1451 | 14.91 |
Industrial Chipboard | 0.68 | 94.8 | 0.1874 | 27.7 |
Eltapan II > Eltapan I > ELTAPAN III > Eltapan IV > INDUSTRIAL PARTICLEBOARD
The thermal conductivity coefficient (0.1233 kcal/hr∙m·˚C) of Eltapan II was low, that it comprises a low density and content of 50% fine wood chips components.
Thermal conductivity coefficients and density in the modified panels and industrial chipboard panels are shown in the graph of
Bending strength of the modified panels and industrial chipboard was determined. The highest bending strength 14.910 N/mm2 on the Eltapan IV (industrial chipboard: 27.7 N/mm2), while the lowest bending strength values were calculated 5.160 N/mm2 on the Eltapan III. Overall ranking from low to high:
Eltapan III > Eltapan II > Eltapan I > ELTAPAN IV > INDUSTRIAL PARTICLEBOARD
Bending strength on the Eltapan IV was higher (from modified panels). The reason for this, the Eltapan IV is the content of 50% coarse beech wood chips and high density (0.65 g/cm3). Bending strength and density in the modified panels and industrial chipboard panels are shown in the graph of
The optimum properties of the ELTAP IV of modified panels recommended for general use. The IV ELTAP of modified panels has of maximum bending strength, in water swelling value is half of industrial chipboards and thermal conductivity is also low. Eltapan II is the most suitable for the isolation use